# East Asia Brief — AMD

4 briefings mentioning AMD.

- [AMD weighs Samsung foundry alliance to ease reliance on TSMC](https://eastasiabrief.com/semiconductors/amd-weighs-samsung-foundry-alliance-ease-reliance-tsmc-573) — Lisa Su said in Seoul that the chipmaker is exploring production with Samsung Electronics, testing a hedge against single-foundry exposure for advanced AI and… *(October 7, 2026; Semiconductors · Korea · AMD, Samsung Electronics)*
- [TSMC raises 2nm wafer target to 120,000 units as orders surge](https://eastasiabrief.com/semiconductors/tsmc-raises-2nm-wafer-target-120-000-units-orders-411) — The foundry lifted internal production goals by pulling forward capacity additions after Apple, Nvidia and three other anchor clients expanded bookings by up… *(September 28, 2026; Semiconductors · Global · TSMC, Samsung Electronics)*
- [Samsung narrows SK hynix HBM lead as HBM4 shipments expand](https://eastasiabrief.com/semiconductors/samsung-narrows-sk-hynix-hbm-lead-hbm4-shipments-expand-192) — Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers shift toward custom foundry… *(September 6, 2026; Semiconductors · Korea · Samsung Electronics, SK hynix)*
- [South Korean substrate makers develop embedded silicon bridges for AI chips](https://eastasiabrief.com/semiconductors/south-korean-substrate-makers-develop-embedded-silicon-bridges-ai-97) — LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI accelerators and HBM. *(August 28, 2026; Semiconductors · Korea · LG Innotek, Samsung Electro-Mechanics, SK hynix)*

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Publisher: East Asia Brief — https://eastasiabrief.com/