# TSMC captures 72.5% foundry share as gap with Samsung widens

*Surging demand for artificial intelligence processors and proprietary advanced packaging leaves contract rivals trailing across cutting-edge nodes.*

**Published:** September 28, 2026  
**By:** Mina Okoro  
**Section:** Analysis & Comparison — Cross-border  
**Format:** Asia Compare  
**Confidence:** high  
**Source:** https://eastasiabrief.com/analysis/tsmc-captures-72-5-foundry-share-gap-samsung-widens-401  
**Publisher:** East Asia Brief (https://eastasiabrief.com/)

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## What to know

- TSMC took 72.5% of the $53.49 billion foundry market as the gap with Samsung reached 66.6 percentage points
- Nvidia secured approximately 60% of TSMC CoWoS packaging capacity for accelerator production
- TSMC plans to implement 5% to 10% price increases across advanced wafer nodes on Jan. 1, 2027

![A technician in cleanroom attire operates a control console beside advanced equipment inside a semiconductor manufacturing facility. (AI-generated image)](https://eastasiabrief.com/media/2026-09-27-b642f4fcf44f.webp)
*A technician in cleanroom attire operates a control console beside advanced equipment inside a semiconductor manufacturing facility. (AI-generated image)*

Taiwan Semiconductor Manufacturing Co. consolidated 72.5% of global contract chipmaking revenue on Sept. 25, widening its market share lead over second-place Samsung Electronics to 66.6 percentage points.

Industry revenue across the top 10 pure-play and integrated foundries rose 11.5% quarter-over-quarter to a record $53.49 billion, according to compiled transaction benchmarks.

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Cite as: East Asia Brief, "TSMC captures 72.5% foundry share as gap with Samsung widens," September 28, 2026. https://eastasiabrief.com/analysis/tsmc-captures-72-5-foundry-share-gap-samsung-widens-401