# Doosan commits $397 million to China advanced chip packaging materials

*The Changshu project represents 57% of Doosan's electronic materials budget as global advanced packaging spending reaches $28 billion this year.*

**Published:** November 6, 2026  
**By:** Mina Okoro  
**Section:** Analysis & Comparison — Cross-border  
**Format:** Asia Compare  
**Confidence:** high  
**Source:** https://eastasiabrief.com/analysis/doosan-commits-397-million-china-advanced-chip-packaging-materials-1192  
**Publisher:** East Asia Brief (https://eastasiabrief.com/)

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## What to know

- Global advanced packaging capex reaches $28 billion this year to unblock AI accelerators
- Amkor commits 3 trillion won to Gwangju as Nvidia prepayments top $3 billion across suppliers
- First two Gwangju packaging lines finish in late 2027 with KYEC testing live by April 2027

![A technician in cleanroom attire monitors a robotic arm working on a circuit board in a semiconductor manufacturing facility. (AI-generated image)](https://eastasiabrief.com/media/2026-11-06-d2388d6aa6e2.webp)
*A technician in cleanroom attire monitors a robotic arm working on a circuit board in a semiconductor manufacturing facility. (AI-generated image)*

Doosan committed 550 billion won ($397 million) on Nov. 6 to expand high-end packaging materials in China, reinforcing a multibillion-dollar capital spending drive across East Asia to ease artificial intelligence chip shortages.

The Changshu project accounts for 57% of Doosan's 970 billion won ($700 million) electronic materials program, the company said. Global capital expenditure on advanced semiconductor packaging will reach $28 billion this year, exceeding traditional packaging spending for the first time.

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Cite as: East Asia Brief, "Doosan commits $397 million to China advanced chip packaging materials," November 6, 2026. https://eastasiabrief.com/analysis/doosan-commits-397-million-china-advanced-chip-packaging-materials-1192